 |
|
|
- Single-, double-, and multi-layer printed wiring boards
- 1-24 layers
- High performance material
- Standard and large panel formats
- Multiple surface finishing capabilities
- Controlled and differential impedance
- Thick surface copper processing
- Thin core manufacturing
- Sequential lamination
- Heatsink lamination
- Blind and buried via
- Hardware assembly (Mil. Certified)
- Machining capabilities
- 3 mil. lines/spaces
- .008 mil. holes
- 10 to 1 hole aspect ratio
- Dry film soldermask
- Photo imageable soldermask
|
|
